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Home > Products >  Copper(II) borofluoride 38465-60-0

Copper(II) borofluoride 38465-60-0 CAS NO.38465-60-0

  • Min.Order: 1 Kilogram
  • Payment Terms: L/C,T/T,MoneyGram
  • Product Details

Keywords

  • Copperfluoroborate
  • 12% Copper(II) borofluoride
  • 38465-60-0 manufacturer

Quick Details

  • ProName: Copper(II) borofluoride 38465-60-0
  • CasNo: 38465-60-0
  • Molecular Formula: Cu.(BF4)2
  • Appearance: dark blue liquid, relative density is ...
  • Application: Used for plating solution of copper an...
  • DeliveryTime: Prompt
  • PackAge: 30kg or 250kg plastic drum
  • Port: Shanghai
  • ProductionCapacity: 30 Metric Ton/Month
  • Purity: 12%min
  • Storage: Store in a cool, dry place. Keep conta...
  • Transportation: By sea, air or courier
  • LimitNum: 1 Kilogram
  • Grade: Industrial Grade

Superiority

 

Tangshan Moneide Trading Co., Ltd. is specialized in the export of special fine chemicals.

The company dedicated to the development, production and marketing of chemicals.

Moneide covers whole range from small amount (gram grade) for research to big bulk for industrial production. 

Our products series mainly include electroplating chemicals, organic& inorganic fluoro chemicals, organic phosphonic ligands & intermediates and other special fine chemicals.  

Good quality, competitive price, excellent after-sale services are the key points for the success of our company. 

We wholeheartedly welcome all domestic and foreign clients to cooperate with us on the basis of mutual benefit.

Details

Chemical Name

Copper(II) tetrafluoroborate

Molecular formula

Cu(BF4)2

CAS No.

38465-60-0

EINECS No.

253-959-4

Molecular weight

237.16

Molecular Structure

Details

 Copper fluoroborate (plating grade)

Appearance: dark blue liquid, relative density is about 1.53

Copper fluoroborate (base on Cu2+), % ≥12.0

Free fluoroboric acid (HBF4), % ≤2.0

Free boric acid (HBO3), % ≤1.0

Cl-, % ≤0.005

Iron (Fe), % ≤0.01

Sulfate (SO42-), % ≤0.005

Package:  30kg or 250kg plastic drum

 

Main Application

Used for plating solution of copper and its alloy.

 

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